Electro-optic device and electronic apparatus
AssigneeSeiko Epson Corporation
InventorTakeshi Hagiwara
Life of this patent
Estimating the term…
Abstract
In an electro-optic device 1, connection to first electrodes 40 of a first transparent substrate 10 extending in one direction from the side, to which signals are inputted, is established through electrical conduction between two substrates in a width-wise central area of the first transparent substrate using first terminals 81. To second electrodes 50 of a second transparent substrate 20 which are routed toward the outer side, signals are directly inputted from second terminals 82. The obliquely routed second electrodes 50 are formed of, e.g., an aluminum alloy film, and slit-like openings are formed in the second electrodes 50 to allow passage of light emitted from a backlight device 9.
Claims18
An electro-optic device comprising a first substrate and a second substrate arranged in an opposed relation, said device further comprising:
- an electro-optic layer supported between said first substrate and said second substrate;
- a first electrode formed on said first substrate;
- a second electrode formed on said second substrate;
- a first terminal formed on said second substrate and connected to said first electrode;
- a plurality of driving ICs mounted on said second substrate,
- said first electrode including a drive portion for applying an electric field to said electro-optic layer, and an inter-substrate conducting terminal portion connected to said drive portion and said first terminal,
- said second electrode including a drive portion for applying an electric field to said electro-optic layer, and a second terminal connected to said drive portion,
- said first terminal being located closer to the center than said second terminal,
- said second electrode being made of at least a material having lower electrical resistance than that of said first electrode, and
- said first and second terminals being arranged to lie side by side along one side of said second substrate and connected respectively to said corresponding driving ICs.
An electro-optic device comprising a first substrate and a second substrate arranged in an opposed relation, said device further comprising:
- an electro-optic layer supported between said first substrate and said second substrate;
- a first electrode formed on said first substrate;
- a second electrode formed on said second substrate;
- a first terminal formed on said second substrate and connected to said first electrode;
- a plurality of driving ICs mounted on said second substrate,
- said first electrode including a drive portion for applying an electric field to said electro-optic layer, and an inter-substrate conducting terminal portion connected to said drive portion and said first terminal,
- said second electrode including a drive portion for applying an electric field to said electro-optic layer, and a second terminal connected to said drive portion,
- said second terminal being located on the outer side relative to said first terminal,
- said second electrode being made of at least a material having lower electrical resistance than that of said first electrode, and
- said first and second terminals being arranged to lie side by side along one side of said second substrate and connected respectively to said corresponding driving ICs.
An electro-optic device comprising a first substrate and a second substrate arranged in an opposed relation, said device further comprising:
- an electro-optic layer supported between said first substrate and said second substrate,
- a first electrode formed on said first substrate,
- a second electrode formed on said second substrate,
- a first terminal formed on said second substrate and connected to said first electrode,
- a plurality of driving ICs mounted on said second substrate,
- an extended portion of said second substrate extending out of an edge of said first substrate,
- said first electrode including a drive portion for applying an electric field to said electro-optic layer, and an inter-substrate conducting terminal portion connected to said drive portion and said first terminal,
- said second electrode including a drive portion for applying an electric field to said electro-optic layer, and a second terminal connected to said drive portion,
- said first and second terminals being disposed in at least said extended portion,
- said second terminal being located on the outer side relative to said first terminal,
- said second electrode being made of at least a material having lower electrical resistance than that of said first electrode, and
- said first and second terminals being arranged to lie side by side along one side of said second substrate and connected respectively to said driving ICs.
An electro-optic device comprising a first substrate and a second substrate arranged in an opposed relation, said device further comprising:
- an electro-optic layer supported between said first substrate and said second substrate,
- a first electrode formed on said first substrate,
- a second electrode formed on said second substrate,
- a first terminal formed on said second substrate and connected to said first electrode,
- a plurality of driving ICs mounted on said second substrate,
- said first electrode including a drive portion for applying an electric field to said electro-optic layer, and an inter-substrate conducting terminal portion connected to said drive portion and said first terminal,
- said second electrode including a drive portion for applying an electric field to said electro-optic layer, a second terminal connected to said drive portion, and a wiring portion for connecting said drive portion and said second terminal,
- said wiring portion of said second electrode being located on the outer side relative to said first terminal in a direction along one side of said second substrate,
- said second electrode being made of at least a material having a lower electrical resistance than that of said first electrode, and
- said first and second terminals being arranged to lie side by side along one side of said second substrate and connected respectively to said driving ICs.
Dependencies are inferred from the claim text.