Acoustic wave device and method of producing the same
OwnerYoshio Satoh, Ken-ya Hashimotoinventors
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Abstract
An acoustic wave device includes: a first substrate that has a vibration unit that generates solid vibrations based on an input electric signal, and an electrode pad unit that introduces the electric signal into the vibration unit; and a second substrate that has through holes for connecting the electrode pad unit to external electrodes. In this acoustic wave device, at least the vibration unit of the first substrate is hermetically sealed by bonding the first substrate and the second substrate to each other.
Claims32
An acoustic wave device comprising:
- a first substrate that has a vibration unit that generates solid vibrations based on an input electric signal, and an electrode pad unit that introduces the electric signal into the vibration unit;
- and
- a second substrate that has through holes for connecting the electrode pad unit to external electrodes,
- at least the vibration unit of the first substrate being hermetically sealed by bonding the first substrate and the second substrate to each other.
An acoustic wave device comprising:
- a first substrate that has a vibration unit that generates solid vibrations based on an input electric signal;
- a second substrate that is bonded to the upper face of the first substrate;
- and
- a third substrate that is bonded to the lower face of the first substrate,
- the second substrate or the third substrate having a through hole for electrically connecting the first substrate to an external electrode, and
- at least the vibration unit of the first substrate being hermetically sealed by bonding the second substrate and the third substrate to the first substrate.
A method of producing an acoustic wave device, comprising the step of
- bonding a second substrate to a first substrate, the first substrate having a vibration unit that generates solid vibrations based on input electric signal and an electrode pad unit that introduces the electric signal into the vibration unit, the second substrate having through holes for electrically connecting the electrode pad unit to external electrodes, and the second substrate being bonded to a face of the first substrate on which the vibration unit is formed, to thereby hermetically seal at least the vibration unit of the first substrate.
A method of producing an acoustic wave device, comprising the steps of:
- bonding a second substrate onto the upper face of a first substrate on which a vibrator is formed, the vibrator generating solid vibrations based on an input electric signal;
- and
- bonding a third substrate to the lower face of the first substrate, the third substrate having a through hole for connecting the vibrator to an external electrode,
- at least the vibrator of the first substrate being hermetically sealed through the foregoing steps.
Dependencies are inferred from the claim text.