Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device

A method of manufacturing a piezoelectric device comprising a cover fixed to a package having a through hole for communicating the outside to an internal space, which accommodates a piezoelectric vibrating reed, the method comprising:

• arranging a plurality of packages the bottoms of which face halogen lamps;
• irradiating the bottoms of the packages with light beams from the halogen lamps in the air to thermally melt a brazing material disposed between the packages and the covers, the brazing material comprising a compound of oxygen and metal atoms, thereby sealing each of the packages with the cover;
• evacuating the internal space of each of the packages through the through hole;
• and then
• filling the through holes with a sealing material in a vacuum atmosphere to seal the through holes.

A method of sealing packages of piezoelectric devices with covers, each piezoelectric device comprising the cover fixed to the package in which a piezoelectric vibrating reed is partially supported and fixed, the method comprising:

• arranging the plurality of packages with the covers disposed thereon and facing halogen lamps in a state where a brazing material is interposed between the packages and the covers;
• irradiating the covers of the packages with light beams from the halogen lamps to heat the covers;
• and
• thermally melting the brazing material.

A method of manufacturing a piezoelectric device comprising a cover fixed to a package having a through hole for communicating the outside to an internal space, which accommodates a piezoelectric vibrating reed, the method comprising:

• arranging a plurality of packages with the covers disposed thereon and facing halogen lamps in a state where a brazing material is interposed between the packages and the covers, the brazing material comprising a compound of oxygen and metal atoms;
• heating the covers of the packages by irradiating the covers with light beams from the halogen lamps in the air to thermally melt the brazing material, thereby sealing each of the packages with the cover;
• evacuating the internal space of each of the packages through the through hole;
• and
• filling the through holes with a sealing material in a vacuum atmosphere to seal the through holes.

An apparatus for sealing packages of piezoelectric devices with covers, each piezoelectric device comprising the cover fixed to the package in which a piezoelectric vibrating reed is partially supported and fixed, the apparatus comprising:

• a means for holding the plurality of packages the bottoms or the covers of which face lamps;
• a mask disposed outside the plurality of packages so as to expose at least the holding means for holding the plurality of packages;
• and
• a lamp unit for irradiating the packages with light beams from halogen lamps from above the mask.