Direct fet device for high frequency application
AssigneeInternational Rectifier Corporation
InventorJohn E. Larking
Life of this patent
Estimating the term…
Abstract
A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second major surface, and a thin metal clip electrically connected to the first major electrode of the die. The thin metal clip has a relatively large surface area, and package resistance which is caused by skin effect phenomenon is reduced thereby in high frequency applications.
Claims37
A method for decreasing resistance in external connections of a semiconductor device package in high frequency applications, the method comprising:
- providing a semiconductor device package comprising a semiconductor die having first and second major surfaces;
- providing first and second major electrodes on said respective major surfaces, and a control electrode disposed on said second major surface;
- and
- providing a metal clip having a flat web portion and electrically connecting said metal clip to said first major surface, said metal clip having dimensions that reduce the resistance of said semiconductor package when a current is supplied to said semiconductor package at a high frequency.
A method of fabricating a semiconductor device package, said method comprising:
- providing a semiconductor device package comprising a semiconductor die having first and second major surfaces;
- providing a gate electrode and a source electrode on said second major surface;
- providing a drain electrode on said first major surface;
- providing a metal clip having a flat web portion and electrically connecting said metal clip to said drain electrode and to a printed circuit board.
A semiconductor device package, said semiconductor package comprising:
- a molded housing containing a semiconductor die;
- said semiconductor die having first and second major surfaces;
- first and second major electrodes in said molded housing and on said respective major surfaces, and a control electrode disposed on said second major surface;
- and
- a metal clip having a web portion and electrically connecting said metal clip to said first major surface, wherein overall resistance of said semiconductor package is reduced by said metal clip when a current is supplied to said semiconductor package at a high frequency.
Dependencies are inferred from the claim text.