Electronic apparatus having an adhesive layer from wafer level packaging

A semiconductor wafer, comprising:

• at least one die having a first side and a second side, the second side opposite the first side, the at least one die having an array of connection pads thereon, the connection pads electrically coupled to circuits on the at least one die;
• an adhesive layer covering the first side of the at least one die, the adhesive layer having an array of openings, where the array of openings provides access to the array of connection pads;
• a conductive material substantially filling the array of openings, the conductive material adapted to permit electrical interconnection through the adhesive layer to the array of connection pads;
• and
• a protective coating on the second side of the at least one die.

An electronic system comprising:

• a processor;
• and
• a pre-packaged flip chip coupled to the processor, wherein the flip chip includes:
• a first semiconductor device having a first side and a second side, the first side having a first array of connection pads, the connection pads electrically coupled to circuits on the first semiconductor device;
• a second semiconductor device having a first side comprising a second array of connection pads, wherein the second side of the first semiconductor device is coupled to the first side of the second semiconductor device such that the second array of connection pads is adjacent the first array of connection pads;
• an adhesive layer covering the first side of the first semiconductor device and the first side of the second semiconductor device, the adhesive layer having an array of openings substantially aligned with one or more connection pads of either the first array of connection pads or the second array of connection pads;
• and
• a conductive material substantially filling the array of openings.

An electronic system comprising:

• a processor;
• and
• a pre-packaged flip chip coupled to the processor, wherein the flip chip includes:
• a first semiconductor device having a first side and a second side, the first side comprising a first array of connection pads, the connection pads electrically coupled to circuits on the first semiconductor device;
• an adhesive layer covering the first side of the first semiconductor device, the adhesive layer having an array of openings substantially aligned with one or more connection pads of the first array of connection pads;
• and
• a conductive material substantially filling the array of openings.

An electronic system comprising:

• a processor;
• and
• a flip chip coupled to the processor, wherein the flip chip includes:
• a die having an active side and a back side, the back side opposite the active side, the active side comprising an array of connection pads, the connection pads electrically coupled to circuits on the die;
• an adhesive layer covering the active side of the die, the adhesive layer having an array of openings substantially aligned with one or more connection pads of the array of connection pads;
• a conductive material substantially filling the array of openings;
• a protective coating on the back side of the die;
• and
• a support coupled to the die, the support having an array of conductors substantially aligned with the one or more connection pads of the array of connection pads.

An electronic system comprising:

• a processor;
• and
• a flip chip coupled to the processor, wherein the flip chip includes:
• a first die having an active side and a back side, the active side of the first die having a first array of connection pads, the connection pads electrically coupled to circuits on the first die;
• a second die having an active side and a back side, the active side of the second die having a second array of connection pads, wherein the back side of the first die is coupled to the active side of the second die such that the second array of connection pads are accessible and the first array of connection pads are accessible;
• an adhesive layer covering the active side of the first die and the active side of the second die, the adhesive layer having an array of openings providing access with one or more connection pads of either the first array of connection pads or the second array of connection pads;
• a conductive material substantially filling the array of openings;
• and
• a protective coating on the back side of the second die.

An electronic system comprising:

• a processor;
• and
• a flip chip coupled to the processor, wherein the flip chip includes:
• a first die having a first side and a second side, the first side comprising a first array of connection pads, the connection pads electrically coupled to circuits on the first die;
• a second die having a first side comprising a second array of connection pads, wherein the second side of the first die is coupled to the first side of the second die such that the second array of connection pads are accessible and the first array of connection pads are accessible;
• an adhesive layer covering the first side of the first die and the first side of the second die, the adhesive layer having an array of openings substantially aligned with both the first array of connection pads and with the second array of connection pads, wherein the adhesive layer forms a mating surface adapted to attach to a support;
• and
• a conductive material substantially filling the array of openings.

An electronic system comprising:

• a processor;
• and
• a flip chip coupled to the processor, wherein the flip chip includes:
• a first die having an active side and a back side, the active side of the first die having a first array of connection pads, the back side of the first die having a bonding layer, the connection pads electrically coupled to circuits on the first die;
• a second die having an active side and a back side, the active side of the second die having a second array of connection pads, wherein the bonding layer of the back side of the first die is coupled to the active side of the second die such that the second array of connection pads are accessible and the first array of connection pads are accessible, wherein one or more connection pads of the second array are interconnected with one or more connection pads of the first array;
• an adhesive layer covering for the active side of the first die and the active side of the second die, the adhesive layer having an array of openings substantially aligned with both the first array of connection pads and with the second array of connection pads, wherein the adhesive layer forms a mating surface;
• and
• a conductive material substantially filling the array of openings;
• and a support to which the adhesive attaches.