Semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorTakashi Noguchi
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip having a main surface provided with an integrated circuit including a photoelectric converter and a first wiring for electrically connecting the integrated circuit of the semiconductor chip to respective external terminals. The semiconductor device also includes a sealing resin for sealing the main surface of the semiconductor chip and the first wiring, formed so as to have an opening over the surface of the integrated circuit and a light-transmitting cap for covering the opening of the sealing resin.
Claims15
A semiconductor device comprising:
- a semiconductor chip having a main surface provided with an integrated circuit including a photoelectric converter;
- a first wiring for electrically connecting the integrated circuit of the semiconductor chip to respective external terminals;
- a sealing resin for sealing the main surface of the semiconductor chip and the first wiring, formed so as to have an opening over the surface of the integrated circuit;
- and
- a light-transmitting cap for covering the opening of the sealing resin.
A semiconductor device comprising:
- a semiconductor chip which has a main surface provided with an integrated circuit including a photoelectric converter;
- a plurality of electrode pads which is formed on the main surface;
- a plurality of first wiring patterns each of which has one end connected to the corresponding electrode pad and the other end;
- a plurality of bump electrodes each of which has a bottom surface contacting with the one end of the corresponding first wiring pattern and a top surface;
- a sealing resin which seals surfaces of the first wiring patters, sides of the bump electrodes, wherein the electrode pads, the first wiring patterns, the bump electrodes and the sealing resin are positioned at periphery of the semiconductor chip;
- a plurality of external terminals each of which is formed on the top surface of the corresponding bump electrode;
- and
- a light-transmitting cap which is provided on the top surfaces of the bump electrodes so as to cover a center of the semiconductor chip.
A semiconductor device comprising:
- a semiconductor chip which has a main surface provided with an integrated circuit including a photoelectric converter;
- a plurality of electrode pads which is formed on the main surface;
- a plurality of redistribution wiring patterns each of which has one end connected to the corresponding electrode pad and the other end;
- a plurality of bump electrodes each of which has a bottom surface contacting with the one end of the corresponding redistribution wiring pattern and a top surface;
- a sealing resin which seals surfaces of the redistribution wiring patters, sides of the bump electrodes, wherein the electrode pads, the redistribution wiring patterns, the bump electrodes and the sealing resin are positioned at periphery of the semiconductor chip;
- a plurality of external terminals each of which is formed on the top surface of the corresponding bump electrode;
- and
- a light-transmitting cap which is provided on the top surfaces of the bump electrodes so as to cover a center of the semiconductor chip.
A semiconductor device comprising:
- a semiconductor chip provided with an integrated circuit formed on a surface thereof, a first wiring electrically connected to the integrated circuit of the semiconductor chip;
- and
- a light-transmitting sealing resin sealing the semiconductor chip and the first wiring.
Dependencies are inferred from the claim text.