Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
AssigneeKaijo Corporation
InventorHiromi Fujisawa
Life of this patent
Estimating the term…
Abstract
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire to the first bonding point; moving the capillary horizontally and vertically while carrying out loop control; bonding the wire to the vicinity of the top of the ball bonded to the first bonding point; and thereafter, moving the capillary horizontally and vertically to the second bonding point while delivering the wire and carrying out loop control, and then bonding the wire to the second bonding point.
Claims16
A wire loop comprising:
- a wire connecting a first bonding point and a second bonding point therethrough;
- said wire including a ball bonded to said first bonding point, a neck portion adjacent to said ball and a major portion extending from said neck portion to said second bonding point;
- wherein said major portion of said wire has a crushed part formed in proximity to said neck portion by crushing the part of said wire together with a top portion of said ball.
A wire bonding method for bonding a wire between a first bonding point and a second bonding point using a capillary, comprising the steps of:
- (a) bonding a ball formed on a tip end of the wire to said first bonding point;
- (b) moving said capillary horizontally and vertically while carrying out loop control, to thereby form a kink in a neck portion of the wire adjacent to said ball;
- (c) bonding the wire to a top or the vicinity of the top of said ball bonded to said first bonding point;
- and
- (d) thereafter, moving said capillary horizontally and vertically to said second bonding point while delivering the wire from said capillary and carrying out loop control, and then bonding the wire to said second bonding point;
- wherein the step includes crushing a part of the wire and the top of said ball with said capillary to form a crushed part in the wire.
A semiconductor device comprising:
- a first bonding point;
- a second bonding point;
- and
- a wire bonded to said first bonding point and said second bonding point to connect said first bonding point and said second bonding point therethrough;
- wherein said wire includes a ball bonded to said first bonding point, a neck portion adjacent to said ball and a major portion extending from said neck portion to said second bonding point;
- and
- wherein said major portion of said wire has a crushed part formed in proximity to said neck portion by crushing the part of said wire together with a top portion of said ball.
Dependencies are inferred from the claim text.