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US 2004/0104476 A1Published application
Method of manufacturing semiconductor chip having supporting member and semiconductor package having the semiconductor chip
AssigneeOki Electric Industry Co., Ltd.
InventorNaofumi Iwamoto
Life of this patent
Estimating the term…
Abstract
A semiconductor chip includes a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area, a pad formed in the first area and a bump electrode formed on the pad, and at least one supporting member formed in the second area.
Claims31
A semiconductor chip, comprising:
- a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area;
- a pad formed in the first area;
- a bump electrode formed on the pad;
- and
- at least one supporting member formed on the second area.
2 more elements
A semiconductor package, comprising:
- a main substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area;
- a pad formed in the first area;
- a bump electrode formed on the pad;
- at least one supporting member formed on the second area;
- a tape substrate, which has a main surface and a back surface opposite to the main surface, having a land electrode on the main surface thereof, the land electrode is connected to the bump electrode;
- and
- resin material introduced into a gap, which is formed between the main substrate and the tape substrate.
4 more elements
A tape substrate, comprising:
- a tape having a main surface, the main surface including a flame-shaped first area, and a second area encompassed by the first area;
- a land electrode formed in the first area;
- an I/O electrode formed in the first area;
- a wiring pattern formed in the first area, the wiring pattern connecting the land electrode to the I/O electrode;
- a resist pattern formed on the wiring pattern;
- and
- at least one supporting member formed in the second area.
4 more elements
A method of forming a semiconductor chip, comprising:
- providing a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area;
- forming a pad in the first area;
- forming a bump electrode on the pad;
- and
- forming at least one supporting member on the second area.
2 more elements
A method of forming a semiconductor package, comprising:
- providing a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area;
- forming a pad in the first area;
- forming a bump electrode on the pad;
- forming at least one supporting member on the second area;
- providing a tape substrate having a land electrode;
- connecting the bump electrode to the land electrode;
- and
- connecting the supporting member to the tape substrate.
5 more elements
A method of forming a semiconductor package, comprising:
- providing a semiconductor chip including a main substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area, a pad formed in the first area, a bump electrode formed on the pad, and at least one supporting member formed on the second area;
- preparing an assemble apparatus having a recess at its center;
- providing a tape substrate having a land electrode;
- placing the tape substrate on the assemble apparatus wherein an area on the tape substrate, which is encompassed by the land electrode, is disposed on the recess of the assemble apparatus;
- and
- mounting the semiconductor chip on the tape substrate, and connecting the bump electrode to the land electrode.
3 more elements
Dependencies are inferred from the claim text.