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US 2004/0104475 A1Published application
[high density semiconductor package]
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorSung-Fei Wang
Life of this patent
Estimating the term…
Abstract
A high density semiconductor package comprises a substrate, a first package module and a plurality of second package modules. The substrate has a surface on which the first package module and the second package modules are disposed, wherein the second package modules surround the first package module.
Claims23
A high density semiconductor package, comprising:
- a substrate, having a surface;
- a first package module, being disposed on the surface of the substrate;
- and
- four second package modules, being disposed on the surface of the substrate surrounding the first package module.
1 more element
A high density semiconductor package, comprising:
- a substrate having a surface;
- a first package module, being disposed on the surface of the substrate;
- and
- four second package modules, being disposed on the surface of the substrate surrounding the first package module, wherein a gap width between the first package module and the second package modules is large enough to fill an underfill material therein.
1 more element
A high density semiconductor package, comprising:
- a substrate, having a surface;
- a first package module, being disposed on the surface of the substrate;
- and
- a plurality of second package modules, being disposed on the surface of the substrate surrounding the first package module, wherein a corner of each of the second package modules face a side of the first package module.
1 more element
A high density semiconductor package at least comprising:
- a substrate, having a surface;
- a first package module, being disposed on the surface of the substrate;
- and
- at least one package module, being adjacent to the first package module with a gap width between the first package module and the second package modules being large enough to fill an underfill material therein.
1 more element
Dependencies are inferred from the claim text.