Semiconductor package and package stack made thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsJin-Ho Kim, Se-Yong Oh
Life of this patent
Estimating the term…
Abstract
A semiconductor package comprises a board, a plurality of solder bump pads, a plurality of board pads, a plurality of distribution patterns, a plurality of contact pads, at least one chip, a plurality of bonding wire, an encapsulation part and a plurality of solder bumps. In order to reduce the height of the loop of the bonding wires for connecting the bonding pad on the semiconductor chip to the board pads on the board, the ends of the bonding wires are connected to the bonding pads and board pads respectively by wedge bonding. Thus, a very thin package can be obtained. In addition, a thin package stack can be obtained by stacking the very thin packages.
Claims9
A semiconductor package, comprising:
- a board having an upper surface, a lower surface and an aperture;
- a plurality of solder bump pads formed on the lower surface of the board;
- a plurality of board pads formed on the lower surface of the board;
- a plurality of distribution patterns for electrically connecting the solder bump pads to the board pads;
- a plurality of contact pads formed on the upper surface of the board, and electrically connected to the solder bump pads;
- at least one chip having a plurality of bonding pads, disposed in the aperture;
- a plurality of bonding wires electrically connecting the bonding pads to the board pads, at least one end of the bonding wires being bonded to the bonding pads or the board pads by wedge bonding;
- an encapsulation part provided on the lower surface of the board for encapsulating the at least one chip, the plurality of bonding wires and the plurality of board pads;
- and
- a plurality of solder bumps formed on the plurality of solder bump pads.
A method of manufacturing a semiconductor package, comprising:
- forming a plurality of solder bump pads on one surface of a board;
- forming a plurality of board pads on the one surface of the board;
- placing at least one chip having a plurality of bonding pads in an aperture of the board;
- wedge bonding at least one end of a plurality of bonding wires to electrically connect the bonding pads to the plurality of board pads;
- encapsulating the at least one chip, the plurality of bonding wires and the plurality of board pads on the one surface of the board;
- and
- forming a plurality of solder bumps on the plurality of solder bump pads.
Dependencies are inferred from the claim text.