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US 2004/0104473 A1Published application
Semiconductor component having conductors with wire bondable metalization layers
AssigneeMicron Technology, Inc.
InventorWarren M. Farnworth
Life of this patent
Estimating the term…
Abstract
A semiconductor component includes a semiconductor die, a low k polymer layer on the die and redistribution conductors on the polymer layer. The component also includes bonding pads on the conductors with a metal stack construction that includes a conductive layer, a barrier/adhesion layer and a non-oxidizing layer. The bonding pads facilitate wire bonding to the component and the formation of reliable wire bonds on the component. A method for fabricating the component includes the steps of forming the conductors and bonding pads using electroless deposition. The component can be used to fabricate electronic assemblies such as modules, packages and printed circuit boards.
Claims68
A semiconductor component comprising:
- a semiconductor die comprising a die contact;
- a polymer layer on the die;
- a redistribution conductor on the polymer layer in electrical communication with the die contact;
- and
- a bonding pad on the polymer layer comprising a portion of the conductor, and a metal layer on the portion.
2 more elements
A semiconductor component comprising:
- a semiconductor die including a circuit side and a plurality of die contacts on the circuit;
- a polymer layer on the circuit side;
- a plurality of redistribution conductors on the polymer layer in electrical communication with the die contacts;
- a plurality of bonding pads on the polymer layer in electrical communication with the conductors, each bonding pad comprising a conductive layer, a barrier/adhesion layer and a non-oxidizing layer.
1 more element
A semiconductor component comprising:
- a semiconductor die including a plurality of integrated circuits and a plurality of die contacts in electrical communication with the circuits having a first pattern;
- a polymer layer on the die;
- a plurality of conductors on the polymer layer;
- a plurality of bonding pads on the polymer layer in electrical communication with the conductors and having a second pattern;
- the conductors and the bonding pads comprising a metal stack including a conductive layer, a barrier/adhesion layer and a non-oxidizing layer.
2 more elements
A semiconductor component comprising:
- a semiconductor die including a circuit side and a plurality of die contacts on the circuit having a first pattern;
- a polymer layer on the circuit side;
- a plurality of conductors on the polymer layer in electrical communication with the die contacts;
- and
- a plurality of bonding pads on the conductors having a second pattern;
- each conductor and each bonding pad comprising a conductive layer, a barrier/adhesion layer and a non-oxidizing layer.
3 more elements
A method for fabricating a semiconductor component comprising:
- providing a semiconductor die comprising a die contact;
- forming a polymer layer on the die;
- forming a redistribution conductor on the polymer layer in electrical communication with the die contact;
- forming a bonding pad on the conductor;
- forming a first metal layer on the bonding pad;
- and
- forming a non-oxidizing metal layer on the first metal layer.
4 more elements
A method for fabricating a semiconductor component comprising:
- providing a die comprising a circuit side and a plurality of die contacts on the circuit side having a first pattern;
- forming a polymer layer on the circuit side;
- forming a plurality of conductors on the polymer layer in electrical communication with the die contacts;
- forming a plurality of bonding pads on the polymer layer in electrical communication with the conductors and having a second pattern;
- forming a barrier/adhesion layer on the conductors and the bonding pads;
- and
- forming a non-oxidizing layer on the barrier/adhesion layer.
4 more elements
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a semiconductor die comprising a plurality of die contacts;
- forming a plurality of metal bumps on the die contacts;
- forming a polymer layer on the die and planarizing the polymer layer and the metal bumps to a same surface;
- forming a plurality of conductors on the polymer layer in electrical communication with the metal bumps, the conductors comprising bonding pads having a different pattern than the die contacts;
- forming a barrier/adhesion layer on the conductors and the bonding pads;
- forming a non-oxidizing layer on the barrier/adhesion layer;
- and
- singulating the die from the substrate.
5 more elements
A method for fabricating a semiconductor component comprising:
- providing a semiconductor die including a circuit side and a plurality of die contacts on the circuit having a first pattern;
- forming a polymer layer on the circuit side;
- forming a plurality of conductors on the polymer layer in electrical communication with the die contacts;
- and
- forming a plurality of bonding pads on the conductors having a second pattern;
- forming a barrier/adhesion layer on the conductors and the bonding pads;
- and
- forming a non-oxidizing layer on the barrier/adhesion layer.
5 more elements
An electronic assembly comprising:
- a supporting substrate comprising an electrode;
- a semiconductor component on the substrate comprising a semiconductor die having a die contact, a polymer layer on the die, a redistribution conductor on the polymer layer in electrical communication with the die contact, and a bonding pad on the polymer layer comprising a portion of the conductor, a metal layer on the portion and a non-oxidizing metal on the metal layer;
- and
- a wire bonded to the electrode and to the bonding pad.
1 more element
An electronic assembly comprising:
- a supporting substrate;
- an interposer on the supporting substrate comprising a polymer layer, a plurality of conductors on the polymer layer, and a plurality of bonding pads on the conductors, each bonding pad comprising a barrier/adhesion metal layer and a non-oxidizing metal layer;
- and
- a semiconductor die on the interposer comprising a plurality of die contacts wire boned to the bonding pads.
1 more element
An electronic assembly comprising
- a semiconductor die comprising a plurality of die contacts having a first pattern, a polymer layer, a plurality of conductors on the polymer layer in electrical communication with the die contacts, and a plurality of bonding pads on the conductors having a second pattern, each conductor and each bonding pad comprising a conductive layer, a barrier/adhesion layer and a non-oxidizing layer;
- and
- a plurality of lead fingers attached to the die and wire bonded to the bonding pads.
Dependencies are inferred from the claim text.