Microelectronic packages with self-aligning features
AssigneeTessera, Inc.
InventorsKyong-Mo Bang, Teck-Gyu Kang, Jae M. Park
Life of this patent
Estimating the term…
Abstract
A microelectronic package is made by a process which includes folding a substrate. Alignment elements on different parts of the substrate engage one another during the folding process to position the parts of the substrate precisely relative to one another. One or more of the alignment elements may be a mass of an overmolding encapsulant covering a chip.
Claims29
An intermediate structure for making a microelectronic package comprising:
- (a) a substrate having first and second parts;
- (b) a first microelectronic device attached to said substrate;
- (c) a first alignment element attached to said first part of said substrate;
- and
- (d) a second alignment element attached to said second part of said substrate,
- said substrate being adapted for folding so as to bring said first and second alignment elements into engagement with one anther, said alignment elements being adapted to engage one another so as to retain said second part of said substrate in a pre-selected disposition relative to said first part of said substrate.
A microelectronic package comprising:
- (a) a substrate having first and second parts;
- (b) a first microelectronic device attached to said substrate;
- (c) a first alignment element attached to said first part of said substrate;
- and
- (d) a second alignment element attached to said second part of said substrate, said substrate being folded so that said alignment elements are engaged with one another and retain said second part of said substrate in a pre-selected disposition relative to said first part of said substrate.
A method of making a microelectronic package comprising the steps of:
- (a) forming a first and second elements on first and second parts of a substrate bearing a first microelectronic device;
- and then
- (b) folding said substrate so that said first and second elements engage one another so as to hold said second part of said substrate in a pre-selected disposition relative to said first part of said substrate.
A microelectronic package comprising an elongated substrate having a proximal part, a distal part and a central part disposed between said proximal and distal parts, and a microelectronic device mounted to one of said parts, said substrate being folded so that said proximal and distal parts overlie said central part with said microelectronic device disposed between said central part and said proximal and distal parts, said substrate having a proximal set of traces extending along the substrate from said central part to said proximal part and a distal set of traces extending along the substrate from said central part to said distal part.
Dependencies are inferred from the claim text.