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US 2004/0104465 A1Published application
Wiring board and a packaging assembly using the same
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi Kusakabe, Isao Ozawa
Life of this patent
Estimating the term…
Abstract
A wiring board includes an insulating board defined by a first surface and a second surface opposing to the first surface; first signal strips disposed on the first surface; a first power distribution plane provided on the first surface so as to occupy a residual area of the first signal strips; lands disposed on the second surface; via metals penetrating the insulating board so as to connect the lands to the corresponding first signal strips; a second power distribution plane provided on the second surface.
Claims21
A wiring board comprising:
- an insulating board defined by a first surface and a second surface opposing to the first surface;
- a plurality of first signal strips disposed selectively on the first surface;
- a first power distribution plane provided on the first surface so as to occupy a residual area of the first signal strips, disposing spaces along both sides of the first signal strips such that the first signal strips are electrically isolated from the first power distribution planes;
- a plurality of lands disposed on the second surface;
- a plurality of via metals penetrating the insulating board so as to electrically connect the lands to the corresponding first signal strips respectively;
- and
- a second power distribution plane provided on the second surface so as to occupy a residual area of the lands, disposing spaces along the lands such that the lands are electrically isolated from the second distribution plane.
4 more elements
A packaging assembly comprising:
- an insulating board defined by a first surface and a second surface opposing to the first surface;
- a plurality of first signal strips disposed selectively on the first surface;
- a first power distribution plane provided on the first surface so as to occupy a residual area of the first signal strips, disposing spaces along both sides of the first signal strips such that the first signal strips are electrically isolated from the first power distribution planes;
- a plurality of lands disposed on the second surface;
- a plurality of via metals penetrating the insulating board so as to electrically connect the lands to the corresponding first signal strips respectively;
- a second power distribution plane provided on the second surface so as to occupy a residual area of the lands, disposing spaces along the lands such that the lands are electrically isolated from the second distribution plane;
- and
- a semiconductor chip disposed on the first surface connected to a plurality of the pad potion formed at the end of the first signal strips and the first power distribution plane.
5 more elements
Dependencies are inferred from the claim text.