Semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsSu Tao, Chi Tsung Chiu, Sung Mao Wu
Life of this patent
Estimating the term…
Abstract
A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a high-frequency area on the active surface. The substrate supports the first chip and is electrically connected to the first chip. The middle layer is disposed on the first chip and has a recess corresponding to the high-frequency area. The second chip is disposed on the middle layer and electrically connected to either the first chip or the substrate. The encapsulant encapsulates the first chip, the middle layer, the second chip, and a part of the substrate.
Claims14
A semiconductor package comprising:
- a first chip defining an active surface and having a high-frequency element defining a high-frequency area on the active surface;
- a substrate supporting the first chip and electrically connected to the first chip;
- a middle layer disposed on the first chip and having a recess corresponding to the high-frequency area;
- and
- a second chip disposed on the middle layer and electrically connected to one of the first chip and the substrate.
A semiconductor package comprising:
- a chip defining an active surface and having a high-frequency element defining a high-frequency area on the active surface;
- a substrate supporting the chip;
- a plurality of bumps for electrically connecting the chip to the substrate;
- and
- an encapsulant encapsulating the active surface of the chip, the bumps, and a part of the substrate, and having a cavity positioned below the high-frequency area.
A semiconductor package comprising:
- a chip defining an active surface and having a high-frequency element defining a high-frequency area on the active surface;
- a substrate supporting the chip and electrically connected to the chip;
- an encapsulant encapsulating the active surface of the chip, and a part of the substrate;
- and
- a cavity positioned within the encapsulant above the high-frequency area.
Dependencies are inferred from the claim text.