Semiconductor deivce and method for manufacturing same

A method of manufacturing a semiconductor device, said method comprising the following steps of:

• attaching a releasable protective member to a semiconductor element having a first surface in such a manner that at least a part of said first surface is covered with said protective member;
• arranging a set of molds to define therein a cavity in which said semiconductor element is placed and a part of said mold is in contact with said protective member at a second surface;
• injecting a sealing resin into said cavity to seal said semiconductor element;
• and
• removing said protective member from said first surface of the semiconductor element so that said at least a part of the first surface of the semiconductor is exposed.

A method of manufacturing a semiconductor device, said device comprising:

• a semiconductor element having a first surface, so that at least a part of said first surface is exposed to the outside, while this element is in use;
• a sealing resin for molding said semiconductor element to cover the same, said sealing resin having a second surface and a recess, so that said part of the first surface of the semiconductor element is exposed outside at the bottom of said recess which is opened at said second surface;
• and a protective member having a shape corresponding to said recess, so that, when said protective member is placed in said recess, a bottom face of the protective member is in contact with said part of the first surface and an upper face of the protective member coincides with said second surface of the sealing resin;
• said method comprising the following steps of:
• attaching said protective member to said semiconductor element in such a manner that at least a part of said first surface is covered with said protective member;
• arranging a set of molds to define therein a cavity in which said semiconductor element is placed and a part of said mold is in contact with said protective member at said second surface;
• and
• injecting a sealing resin into said cavity to seal said semiconductor element.