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US 2004/0104453 A1Published application
Method of forming a surface micromachined MEMS device
AssigneeAnalog Devices, Inc.
InventorBruce K. Wachtmann
Life of this patent
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Abstract
A method of forming a surface micromachined MEMS device applies an insulator to a substrate, and then deposits a conductive path on the insulator. The conductive path is capable of transmitting an electronic signal between two points on the MEMS device. The insulator electrically isolates the conductive path from the substrate. The MEMS device illustratively is free of semiconductor junctions formed by the substrate and the conductive path.
Claims20
A method of forming a surface micromachined MEMS device, the method comprising:
- providing a substrate;
- applying an insulator on the substrate;
- and
- depositing a conductive path on the insulator, the conductive path being capable of transmitting an electronic signal between two points on the MEMS device, the insulator electrically isolating the conductive path from the substrate, the MEMS device being free of semiconductor junctions formed by the substrate and the conductive path.
1 more element
A MEMS device comprising:
- a substrate;
- movable structure supported by the substrate;
- circuitry supported by the substrate;
- and
- a conductive path between the movable structure and the circuitry, the conductive path being electrically isolated from the substrate, the conductive path being formed within the MEMS device by surface micromachined processes,
- the MEMS device being free of semiconductor junctions formed by the substrate and the conductive path.
3 more elements
A method of forming a sensor, the method comprising:
- forming an insulator on a substantially intrinsic semiconductor substrate;
- forming a conductive path on the insulator, the insulator being formed and the conductive layer being formed by surface micromachining processes, the insulator electrically isolating the conductive path from the substrate;
- forming circuitry and structure;
- and
- connecting the conductive path between the circuitry and the structure, the conductive path being capable of transmitting an electronic signal between the circuitry and the structure.
2 more elements
Dependencies are inferred from the claim text.