Three- dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same

A three-dimensional spiral inductor comprising:

• a third metal layer suspended in a spiral shape;
• two first supporting bars connected with a underlying substrate or a bottom metal layer vertically from an inner end and an outer end of the spiral shaped third metal layer, for supporting the third metal layer;
• and
• any one among the substrate below the first supporting bars, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate.

A solenoid inductor comprising:

• at least one third metal layer suspended in a bar shape;
• two first supporting bars respectively connected with opposite ends of two adjacent bottom metal layers having the bar shape vertically from both ends of the third metal layer, for supporting the bar-shaped third metal layer;
• the bottom metal layers disposed below the first supporting bar and having the bar shape;
• and
• a substrate disposed below the bottom metal layer.

A three-dimensional solenoid inductor comprising:

• at least one fourth metal layer suspended in a bar shape;
• two second supporting bars connected with opposite ends of two adjacent third metal layers suspended in a bar shape vertically from both ends of the fourth metal layer, for supporting the fourth metal layer;
• at least one third metal layer disposed below the second supporting bar and having the bar shape;
• two first supporting bars vertically connected with a underlying substrate, a bottom metal layer or an integrated circuit on the substrate from both ends of the suspended solenoid inductor including the fourth metal layer, the second supporting bars, and the bar-shaped third metal layer, for supporting the suspended solenoid inductor;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate.

A stack type three-dimensional spiral inductor comprising:

• a fourth metal layer suspended in a spiral shape;
• two second supporting bars connected with one end of an underlying third metal layer suspended in the spiral shape vertically from one end of the spiral-shaped fourth metal layer, connected with an underlying first supporting bar vertically from the other end of the fourth metal layer;
• the third metal layer disposed below the second supporting bars and suspended in the spiral shape;
• two first supporting bars vertically connected with a underlying substrate, a bottom metal layer or an integrated circuit disposed on the substrate from one end that is not connected with the second supporting bar and a lower portion of the second supporting bar that is not connected with the third metal layer, for supporting the two-layered spiral inductors connected in series;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate.

A three-dimensional spiral inductor having an upward suspended lead wire, comprising:

• a fourth metal layer suspended in a bar shape;
• two second supporting bars connected with one end of an underlying third metal layer suspended in a spiral shape vertically from one end of the bar-shaped fourth metal layer, connected with an underlying first supporting bar vertically from the other end of the fourth metal layer;
• the third metal layer disposed below the second supporting bars and suspended in the spiral shape;
• two first supporting bars connected with a underlying substrate, a bottom metal layer or an integrated circuit disposed on the substrate vertically from one end that is not connected with the second supporting bar and a lower portion of the second supporting bar that is not connected with the third metal layer, for supporting the spiral inductor having the upward suspended lead wire;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate.

A three-dimensional spiral inductor having a downward suspended lead wire, comprising:

• a fourth metal layer suspended in a spiral shape;
• two second supporting bars connected with one end of an underlying third metal layer suspended in a bar shape vertically from one end of the spiral-shaped fourth metal layer, connected with an underlying first supporting bar vertically from the other end of the fourth metal layer;
• the third metal layer disposed below the second supporting bars and suspended in the bar shape;
• two first supporting bars connected with a underlying substrate, a bottom metal layer or an integrated circuit disposed on the substrate vertically from one end that is not connected with the second supporting bar and a lower portion of the second supporting bar that is not connected with the third metal layer, for supporting the spiral inductor having the downward suspended lead wire;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate.

A suspended three-dimensional solenoid transformer comprising two suspended three-dimensional solenoid inductors, the suspended three-dimensional solenoid inductor comprising:

• at least one fourth metal layer suspended in a bar shape;
• two second supporting bars connected with opposite ends of two adjacent third metal layers suspended in a bar shape from both ends of the fourth metal layer, for supporting the fourth metal layer;
• at least one third metal layer disposed below the second supporting bar and having the bar shape;
• two first supporting bars vertically connected with a underlying substrate, a bottom metal layer or an integrated circuit disposed on the substrate vertically from both ends of the suspended solenoid inductor including the fourth metal layer, the second supporting bars, and the bar-shaped third metal layer, for supporting the suspended solenoid inductor;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate,
• wherein turns of the suspended solenoid inductor including the fourth metal layer, the second supporting bar, the third metal layer and the first supporting bar are not connected in a single strand, but are divided into two strands of a first turn and a secondary turn, the first turn and the secondary turn being alternatively wound to each other.

A three-dimensional spiral transformer comprising:

• a fourth metal layer suspended in a spiral shape;
• two second supporting bars connected with an underlying first supporting bar vertically from both ends of the fourth metal layer, for supporting the fourth metal layer suspended in the spiral shape;
• a third metal layer disposed below the fourth metal layer and suspended in the spiral shape;
• two first supporting bars connected with a underlying substrate, a bottom metal layer or an integrated circuit disposed on the substrate vertically from both ends of the third metal layer suspended in the spiral shape, for supporting the third metal layer;
• the two first supporting bars vertically connected with the underlying substrate, the bottom metal layer, or the integrated circuit disposed on the substrate, for supporting the two second supporting bars;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and a bottom ground metal layer on the substrate, the substrate and a patterned bottom ground metal layer on the substrate, the substrate, the bottom metal layer on the substrate and the bottom ground metal layer on the substrate, and the substrate, the bottom metal layer on the substrate and the patterned bottom ground metal layer on the substrate.

A three-dimensional transmission line comprising:

• a transmission line made of a suspended third metal layer;
• two first supporting bars connected with an underlying substrate, a bottom metal layer, or an integrated circuit disposed on the substrate vertically from both ends of the suspended transmission line, for supporting the suspended transmission line;
• and
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and the integrated circuit on the substrate, and the substrate, the integrated circuit on the substrate, and the bottom metal layer on the integrated circuit.

A three-dimensional micromirror comprising:

• a suspended metal mirror plate;
• at least one first supporting bar connected with an underlying substrate, a bottom metal layer, or an integrated circuit disposed on the substrate vertically from a predetermined region of the suspended metal mirror plate, for supporting the metal mirror plate;
• any one among the substrate below the first supporting bar, the substrate and the bottom metal layer on the substrate, the substrate and the integrated circuit on the substrate, and the substrate, the integrated circuit on the substrate, and the bottom metal layer on the integrated circuit;
• and
• at least one electrode metal layer formed in a predetermined shape on the substrate disposed below the suspended metal mirror plate.

A three-dimensional inductor model comprising:

• a first port of which one end is grounded;
• a second port of which one end is grounded;
• resistance (R) and inductance (L) components connected in series between the other ends, which are not grounded in the first port, and the second port;
• a fringe capacitance (Cf) component connected between the other ends, which are not grounded in the first port, and the second port;
• a Cs capacitance component connected between the grounded one end of the first port and the other end which is not grounded in the first port;
• and
• the Cs capacitance component connected between the ground one end of the second port and the other end, which is not grounded in the second port.