Back to results
US 2004/0104446 A1Published application
Semiconductor module and power conversion device
AssigneesHitachi, Ltd., Hitachi Car Engineering Co., Ltd.
InventorsAtsuhiro Yoshizaki, Keiichi Mashino, Hiromichi Anan, Yoshitaka Ochiai
Life of this patent
Estimating the term…
Abstract
One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
Claims22
A semiconductor module comprising:
- a semiconductor device having an electrode at both surfaces thereof;
- insulating substrates, each connected to either the surface of said semiconductor device and provided with wiring electrically connected to the corresponding electrode at the surface of said semiconductor device;
- and
- thermal-conductive members, each connected to the opposite side of each said insulating substrate with respect to said semiconductor device;
- wherein said semiconductor device and said insulating substrates form a laminated structure section and, one of said thermal-conductive members is connected to the other thermal-thermal-conductive member across the laminated structure section formed by said semiconductor device and said insulating substrates.
2 more elements
A semiconductor module comprising:
- a semiconductor device having an electrode at both surfaces thereof;
- insulating substrates, each connected to either the surface of said semiconductor device and provided with wiring electrically connected to the corresponding electrode at the surface of said semiconductor device;
- and
- thermal-conductive members, each connected to the opposite side of each said insulating substrate with respect to said semiconductor device;
- wherein said semiconductor device, said insulating substrates and said thermal-conductive member are form a laminated structure section and, one of said thermal-conductive members is connected to the other thermal-thermal-conductive member across the laminated structure section formed by said semiconductor device said insulating substrates, and said thermal-conductive member.
2 more elements
A power conversion device comprising:
- a semiconductor device;
- insulating substrates, each connected to either the surfaces of said semiconductor device;
- thermal-conductive members, each connected to the opposite side of each said insulating substrate with respect to said semiconductor device, said semiconductor device, insulating substrate and thermal-conductive member forming laminated structure section;
- a positive-pole semiconductor module and a negative-pole semiconductor module, each with one of said thermal-conductive members being connected to the other end thereof across the laminated structure section formed by said semiconductor device and said insulating substrates;
- input/output wiring electrically connected to said semiconductor device;
- and
- a heat-releasing structure releasing the heat transmitted to said thermal-conductive members to the outside.
4 more elements
A power conversion device comprising:
- a semiconductor device;
- insulating substrates, each connected to either the surfaces of said semiconductor device;
- thermal-conductive members, each connected to the opposite side of each said insulating substrate with respect to said semiconductor device, said semiconductor device, insulating substrate and thermal-conductive member forming laminated structure section;
- a positive-pole semiconductor module and a negative-pole semiconductor module, each with one of said thermal-conductive members being connected to the other end thereof across the laminated structure section formed by said semiconductor device, said insulating substrate and said thermal-conductive member;
- input/output wiring electrically connected to said semiconductor device;
- and
- a heat-releasing structure releasing the heat transmitted to said thermal-conductive members to the outside.
4 more elements
Dependencies are inferred from the claim text.