SiC-MISFET and method for fabricating the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKunimasa Takahashi, Osamu Kusumoto, Makoto Kitabatake, Masao Uchida, Kenya Yamashita
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKunimasa Takahashi, Osamu Kusumoto, Makoto Kitabatake, Masao Uchida, Kenya Yamashita
Estimating the term…
A storage-type SiC-MISFET includes a SiC substrate, an n-type drift layer, a p-type well region, an n-type source region, a SiC channel layer which contains an n-type impurity and is to be a storage-type channel layer, a p-type heavily doped contact layer, a gate insulation film, a gate electrode and the like. In the storage-type SiC-MISFET, a partially heavily doped layer is formed by partially implanting ions of a p-type impurity into an upper surface portion of the n-type drift layer and containing an impurity of the same conductive type as that of the impurity implanted into the well region at a higher concentration than that in the well region.
A SiC-MISFET comprising:
A method for fabricating a SiC-MISFET, comprising:
The method for fabricating a SiC-MISFET of claim I 1, wherein in the step b), an impurity of the second conductive type is implanted using an implantation mask having an opening corresponding a region of the substrate in which the source region is to be formed, thereby forming the partially heavily doped layer so as to be in contact with the source region.
Dependencies are inferred from the claim text.