CMOS imager with selectively silicided gate
AssigneeMicron Technology, Inc.
InventorHoward E. Rhodes
Life of this patent
Estimating the term…
Abstract
The invention also relates to an apparatus and method for selectively providing a silicide coating over the transistor gates of a CMOS imager to improve the speed of the transistor gates. The method further includes an apparatus and method for forming a self aligned photo shield over the CMOS imager.
Claims98
1 - 16. (Canceled)
( A method of forming a CMOS imager, comprising the steps of:
- forming an insulating layer over a semiconductor substrate having a photo-collection region;
- forming at least one transistor gate over a portion of said insulating layer;
- forming an opaque conductive layer over said photocollection region, said at least one transistor gate and said insulating layer;
- and
- selectively removing said opaque conductive layer from said insulating layer and said photocollection region.
(T ) The method according to daim 28, wherein said opaque conductive layer silicide layer is deposited by sputtering.
A method of forming a CMOS imager, comprising the steps of:
- forming an insulating layer over a semiconductor substrate having a doped photocollection region;
- depositing a doped polysilicon layer over said insulating layer;
- depositing a photocollection insulator over said photocollection region;
- forming an opaque conductive layer over said doped polysilicon layer;
- and
- patterning said imager to form at least one gate stack having said opaque conductive layer over said gate stack.
71 - 86. (Canceled)
(P A CMOS imager having improved transistor speed comprising:
- a substrate doped to a first conductivity type;
- an array of pixel cells formed on said substrate, each of said cells including a photocollection region doped to a second conductivity type, at least one transistor, and a partially removed opaque conductive layer, wherein said transistor includes, over a gate region of the transistor, a remaining portion of said opaque conductive layer, and said photocollection region includes a photogate from which said opaque conductive layer has been removed;
- and
- signal processing circuitry on said substrate, wherein said circuitry is connected to said array.
(I A processing system comprising:
- (i) a processor;
- and
- (ii) a CMOS imaging device coupled to said processor and including:
- a substrate doped to a first conductivity type;
- an array of pixel cells formed on said substrate, each of said cells including a photocollection region doped to a second conductivity type, at least one transistor, and a partially removed opaque conductive layer, wherein said transistor includes, over a gate region of the transistor, a remaining portion of said opaque conductive layer, and said photocollection region includes a photogate from which said opaque conductive layer has been removed;
- and
- signal processing circuitry on said substrate, wherein said circuitry is connected to said array.
(I The system according to claim104, wherein said opaque conductive barrier metal layer is a WN. layer.
1 A CMOS imager having improved transistor speed comprising:
- a substrate doped to a first conductivity type;
- an array of pixel cells formed on said substrate, each of said cells including a photocollection region doped to a second conductivity type with an etched photogate, and at least one transistor having a portion of a deposited opaque conductive layer over a gate region of the transistor;
- and
- signal processing circuitry on said substrate, wherein said circuitry is connected to said array, wherein said photogate is void of said deposited opaque conductive layer.
9A processing system comprising:
- (i) a processor;
- and
- (ii) a CMOS imaging device coupled to said processor and including:
- a substrate doped to a first conductivity type;
- an array of pixel cells formed on said substrate, each of said cells including a photocollection region doped to a second conductivity type with an etched photogate, and at least one transistor having a portion of a deposited opaque conductive layer over a gate region of the transistor;
- and
- signal processing circuitry on said substrate, wherein said circuitry is connected to said array, wherein said photogate is void of said deposited opaque conductive layer.
) A CMOS imager having improved transistor speed comprising:
- a substrate;
- and
- an array of pixel cells formed on said substrate, each of said cells including a photogate, a transfer gate, a reset gate, and a partially removed opaque conductive layer, wherein a remaining portion of said opaque conductive layer remains over said transfer gate and said reset gate, and wherein said photogate is void of said opaque conductive layer.
Dependencies are inferred from the claim text.