Method and apparatus for improving an integrated circuit device
AssigneeIntel Corporation
InventorsTerry Sterrett, Tim Chen
Life of this patent
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Abstract
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.
Claims27
An apparatus, comprising:
- a die having a plurality of contacts;
- a substrate having a plurality of contact pads;
- a plurality of bumps formed on one of said contacts and contact pads;
- a plurality of pockets formed on other of said contacts and contact pads;
- and
- the bumps and pockets forming a covalently bonded structure.
A method, comprising:
- forming a conductive bump on one of a die and a substrate;
- forming a non-conductive pocket on the other of said die and substrate;
- and
- contacting the bump with the non-conductive pocket;
- and
- curing the bump and the non-conductive pocket to form a covalently bonded laminate structure.
A flip chip apparatus, comprising:
- a die including a plurality of bumps initially formed from partially-cured electrically conductive polymer materials;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
A flip chip apparatus, comprising:
- a substrate including a plurality of partially-cured electrically conductive polymer bumps;
- a die including a plurality of contact pads, and partially-cured electrically non-conductive film surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
A flip chip apparatus, comprising:
- a die including a contact pad surrounded by a collar, the collar being initially formed from partially-cured, non-electrically conductive materials, and a bump being formed that extends out of the collar;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the collar and non-conductive film forming a covalently bonded laminate structure.
A flip chip apparatus, comprising:
- a die including a contact pad and a bump, initially formed from partially-cured electrically conductive or partially-cured non-conductive polymer materials, separated from the contact pad;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
A method for making a flip chip apparatus, comprising:
- forming a plurality of electrically conductive polymer bumps on one of a die and a substrate;
- forming an electrically non-conductive film around each of a plurality of contact pads on other of said die and substrate;
- partially curing the bumps and the film;
- and
- contacting the bumps with the contact pads, and curing the bumps and the non-conductive film to form a covalently bonded laminate structure.
An electrically conductive paste, comprising:
- benzocyclobutene;
- and
- filler particles dispersed in the benzocyclobutene.
A method for forming an electrically conductive paste, comprising:
- forming benzocyclobutene;
- and
- dispersing filler particles within the benzocyclobutene.
Dependencies are inferred from the claim text.