Methods for preparing ball grid array substrates via use of a laser
OwnerFrank L. Hallinventor
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
Claims17
A semiconductor device formed by a laser etching process comprising:
- providing a substrate having a surface;
- forming resist on at least a portion of the surface;
- and
- etching the resist from the surface of the substrate using a laser.
A method of enhancing the adhesion of a compound to a surface of a substrate comprising:
- providing said substrate having said surface;
- and
- roughening the surface of the substrate.
An automolding system comprising:
- providing a substrate having a surface;
- preheating the substrate;
- forming a resist layer;
- baking the substrate;
- and
- removing contaminants from the substrate using a laser.
A semiconductor device formed by a laser etching process on a substrate having a surface comprising:
- forming resist on at least a portion of the surface;
- and
- etching the resist from the surface of the substrate using a laser.
Dependencies are inferred from the claim text.