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US 2004/0104198 A1Published application
Fluid ejection device with a composite substrate
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Charles C. Haluzak
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Abstract
A fluid ejection device comprising a composite substrate, wherein the composite substrate has two substrates with a patterned etch mask therebetween, and a fluid channel.
Claims38
A composite substrate of a fluid ejection device comprising:
- first and second opposed planar surfaces;
- a patterned etch mask formed adjacent to and between the opposed planar surfaces;
- and
- a fluid channel fluidically coupling the first and second opposed planar surfaces through a hole in the first and second opposed planar surfaces and an opening in the patterned etch mask, such that fluid is capable of flowing from the second planar surface through the fluid channel to the first planar surface.
1 more element
A method of fabricating a fluid ejection device comprising:
- bonding a top surface of a first substrate to a bottom surface of a second substrate, wherein a patterned etch mask layer is formed on at least one of the top surface of the first substrate and the bottom surface of the second substrate;
- and
- etching a fluid channel in the first and second substrates extending through an opening in the patterned etch mask layer.
A method of fabricating a fluid channel for a fluid ejection device comprising:
- bonding a top surface of a first substrate to a bottom surface of a second substrate, wherein the top surface of the first substrate has a feed trench;
- etching a feed hole from a top surface of the second substrate to the top surface of the first substrate;
- and
- removing a remaining portion of the first substrate to form a fluid channel through the substrates.
1 more element
A method of bonding two semiconductor substrates to form a printhead comprising:
- aligning a top surface of a first substrate with a second substrate, wherein the first substrate has a fluid channel in the top surface;
- heating first and second substrates to a first temperature in a partial vacuum;
- and
- placing the top surface of the first substrate in contact with the second substrate to form a bond.
1 more element
A method of bonding two semiconductor substrates to form a print head comprising:
- providing a first substrate with top and bottom opposed planar surfaces with a patterned mask layer on the top planar surface;
- providing a second substrate with top and bottom opposed planar surface;
- aligning the top surface of the first substrate with the second substrate;
- heating the first and second substrates to a first temperature in a partial vacuum;
- and
- placing the top surface of the first substrate in contact with the second substrate to form a bond.
3 more elements
Dependencies are inferred from the claim text.