Polishing method and electropolishing apparatus
AssigneeSony Corporation
InventorsShuzo Sato, Takeshi Nogami, Zenya Yasuda, Masao Ishihara
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Abstract
A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.
Claims11
A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface, comprising:
- a step of determining an electropolishing end point of said metal film in accordance with a change of a current waveform resulting from electropolishing said metal film.
A polishing method for polishing a metal film formed on a wafer surface having concave and convex patterns so as to fill concave portions on said wafer surface, comprising:
- a step of polishing said metal film by alternating an electropolishing with a chemical mechanical polishing or chemical buffing.
An electropolishing apparatus for electropolishing a metal film formed on a wafer surface, comprising;
- a current detector for detecting a current waveform resulting from electropolishing said metal film;
- and
- an end point determination part for determining an electropolishing end point of said metal film on the basis of a change of a current detected with said current detector.
Dependencies are inferred from the claim text.