Method and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
OwnerHui Wang, Felix Gutman +1inventors
InventorsHui Wang, Felix Gutman, Voha Nuch
Life of this patent
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Abstract
A cell to electroplate and/or electropolish semiconductor wafers includes an electrolyte receptacle and a wafer chuck assembly. The cell also includes a first actuator configured to translate the wafer chuck assembly between a first position and a second position, where the wafer chuck assembly covers the electrolyte receptacle in the first position and retracts from the electrolyte receptacle in the second position.
Claims24
A cell to electroplate and/or electropolish semiconductor wafers comprising:
- an electrolyte receptacle;
- a wafer chuck assembly;
- and
- a first actuator configured to translate the wafer chuck assembly between a first position and a second position, wherein the wafer chuck assembly covers the electrolyte receptacle in the first position and retracts from the electrolyte receptacle in the second position.
A cell to electroplate and/or electropolish semiconductor wafers comprising:
- an electrolyte receptacle having an open top;
- a wafer chuck assembly having:
- a lid that covers the open top of the electrolyte receptacle, and
- a wafer chuck to hold a semiconductor wafer;
- a first actuator assembly to translate the wafer chuck assembly between a first horizontal position and a second horizontal position, wherein the lid of the wafer chuck assembly covers the open top of the electrolyte receptacle when the wafer chuck assembly is in the first horizontal position and wherein the lid of the wafer chuck assembly retracts from the open top of the electrolyte receptacle when the wafer chuck assembly is in the second horizontal position;
- a second actuator assembly to move the wafer chuck between a first vertical position and a second vertical position, wherein the wafer chuck is lowered into the electrolyte receptacle when in the second vertical position and retracted from the electrolyte receptacle when in the first vertical position;
- and
- a third actuator assembly to rotate the wafer chuck.
A method of operating a cell to electroplate and/or electropolish semiconductor wafers, the cell having an electrolyte receptacle and a wafer chuck assembly with a lid and wafer chuck, the method comprising:
- translating the wafer chuck assembly to a first horizontal position, wherein the electrolyte receptacle is covered by the lid of the wafer chuck assembly when the wafer chuck assembly is in the first horizontal position;
- and
- translating the wafer chuck assembly to a second horizontal position, wherein the lid of the wafer chuck assembly is retracted from the electrolyte receptacle when the wafer chuck assembly is in the second horizontal position.
Dependencies are inferred from the claim text.