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AssigneeLG Cable Ltd.
InventorsSangyum Kim, Chang Hee Choi, Cha Jae Jo, Jeong Ik Kim, Kyung Nyung Woo, Joon Seo Ki, Hong Gi Moon
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The present invention relates to a method for manufacturing a low roughness electrodeposited copper foil, and an electrodeposited copper foil manufactured thereby, and uses an electrolyte which basically consists of a sulfuric acid, a copper ion and a chloride ion is adapted with an additive which consists of a HEC (Hydroxyethyl Cellulose) of 0.05˜50 ppm, a SPS (bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm, and a gelatin of 0.1˜100 ppm. The present invention is adapted to manufacture a low roughness electrodeposited copper foil using a conventional copper foil manufacture facility and the electrodeposited copper foil according to the present invention is adapted as a material for a copper clad laminate for a printed circuit substrate and an electrode material for a lithium ion battery.
In a method for manufacturing an electrodeposited copper foil in which a rotating drum and an anode plate which is formed of a curve distanced from the outer surface of the drum by a certain distance are drowned in an electrolyte, said electrolyte consists of a sulfuric acid, copper ion and chloride ion, and the electrodeposited copper foil is deposited on the surface of the drum as a negative current is applied to the drum, and a positive current is applied to the anode plate, a method for manufacturing an electrodeposited copper foil which is characterized in that an additive which consists of a gelatin of 0.1˜100 ppm, a HEC(Hydroxyethyl Cellulose) of 0.05 ppm˜50 ppm, and a SPS(bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm is added to the electrolyte.
Dependencies are inferred from the claim text.