Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same

Abstract

The present invention generally relates to an electrolyte solution used to manufacture an electrolytic copper foil for a secondary battery electrode collector and a printed circuit, and based on a 1-liter electrolyte solution, the present invention contains: 0.5 to 40 mg of at least one sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; 1 to 1000 mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin; and 0.1 to 80 mg of chlorine ion. The electrolytic copper foil in accordance with the present invention has a roughness Rz is less than 2.0 μm, if the electrolytic copper foil is in a thin film state, and has the roughness Rz value of the rough surface within a range of 1.0˜3.5 μm if the surface of the electrolytic copper foil is treated. Since a roughness value of a polished surface is changed according to polishing of a cathode surface, there is no special restriction.

Dependencies are inferred from the claim text.