[printed circuit board design]
OwnerSung-Mao Wuinventor
Life of this patent
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Abstract
A printed circuit board comprises a plurality of patterned circuit layers, a plurality of insulation layers and a plurality of circuits. Each insulation layer is located between a pair of neighboring patterned circuit layers for isolating the patterned circuit layers. The insulation layer and the patterned circuit layers together form a laminated layer. The circuits are formed on the sidewalls of the printed circuit board or the interior sidewalls of a cavity or an opening within the printed circuit board for interconnecting various patterned circuit layers electrically.
Claims20
A printed circuit board, at least comprising:
- a plurality of patterned circuit layers;
- an insulation layer between the patterned circuit layers for isolating the patterned circuit layers from each other, wherein the insulation layer and the patterned circuit layers together form a laminated layer;
- and
- at least one side circuit on a sidewall of the laminated layer for electrically interconnecting at least any two of the patterned circuit layers.
A printed circuit board, at least comprising:
- a plurality of patterned circuit layers;
- an insulation layer between the patterned circuit layers for isolating the patterned circuit layers from each other, wherein the insulation layer and the patterned circuit layers together form a laminated layer, wherein the laminated layer includes a cavity;
- and
- at least one side circuit implemented on an interior sidewall of the cavity for electrically interconnecting at least any two of the patterned circuit layers.
A printed circuit board, at least comprising:
- a plurality of patterned circuit layers;
- an insulation layer between the patterned circuit layers for isolating the patterned circuit layers from each other, wherein the insulation layer and the patterned circuit layers together form a laminated layer, wherein the laminated layer includes an opening;
- and
- at least one side circuit implemented on an interior sidewall of the opening for electrically interconnecting at least any two of the patterned circuit layers.
A printed circuit board, at least comprising:
- a plurality of patterned circuit layers;
- an insulation layer between the patterned circuit layers for isolating the patterned circuit layers from each other, wherein the insulation layer and the patterned circuit layers together form a laminated layer, wherein the laminated layer has a sidewall including at least two selected from the group consisting of an edge sidewall of the laminated layer, an interior sidewall of a cavity of the laminated layer, and an interior sidewall of an opening of the laminated layer;
- and
- at least one side circuit implemented on the sidewall electrically interconnecting at least two of the patterned circuit layers.
Dependencies are inferred from the claim text.