Circuit device and method of manufacturing the same

A circuit device manufacturing method comprising the steps of:

• forming, on a conductive foil, conductive patterns constituting circuit devices of the same type or different types;
• affixing circuit elements onto said conductive patterns;
• molding with insulating resin so as to cover said circuit elements;
• and
• using a laser to cut said insulating resin at locations of the outer peripheral part of each circuit device that are in accordance with a desired shape to thereby perform separation into each of said circuit devices.

A circuit device manufacturing method comprising the steps of:

• forming separation grooves, which are shallower than the thickness of said conductive foil, at regions of the conductive foil except for regions that are to be conductive patterns constituting circuit devices of the same type or different types;
• affixing circuit elements onto said conductive patterns;
• molding with insulating resin so as to cover said circuit elements and fill said separation grooves;
• removing said rear surface of said conductive foil until said insulating resin is exposed;
• and
• using a laser to cut said insulating resin at locations of the outer peripheral part of each circuit device that are in accordance with a desired shape to thereby perform separation into each of said circuit devices.

A circuit device manufacturing method comprising the steps of:

• forming, on regions of a conductive foil, conductive patterns constituting at least one circuit device;
• affixing circuit elements onto said conductive patterns;
• molding with insulating resin so as to cover said circuit elements;
• forming through-holes in said insulating resin;
• and
• separating into individual circuit devices.

A circuit device manufacturing method comprising the steps of:

• forming separation grooves, which are shallower than the thickness of said conductive foil at regions of the conductive foil except for regions that are to be conductive patterns constituting at least one circuit device;
• affixing circuit elements onto said conductive patterns;
• molding with insulating resin so as to cover said circuit elements and fill said separation grooves;
• forming through-holes in said insulating resin so as to partially expose said separation grooves;
• removing the remaining thickness portions of said conductive foil at locations at which said separation grooves are formed to expose said insulating resin filled in said separation groove and said through-holes;
• and
• separating into individual circuit devices.