It laminating double-side circuit board, and production method therefor and multilayer printed circuit board using

(Amended) A method of manufacturing a laminating double-side circuit board comprising metal layers formed on both sides of an insulated substrate and a via hole extending from one of said metal layers on one of said both sides to an other of said metal layers on an other of said both sides, said method comprising the steps of:

• irradiating said circuit board with laser light, to form said via hole;
• thereafter, performing desmear treatment on an inner wall of said via hole;
• and
• filling said via hole with electro-conductive material.

(Amended) A multilayer printed wiring board comprising a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection alternately placed one on another, said wiring board comprising:

• a pad on one of said laminating double-side circuit boards;
• and
• another pad on another one of said laminating double-side circuit boards to be connected via one of said sheets of prepreg for interlayer connection,
• wherein the respective pads are opposed via a through hole filled with electro-conductive material formed through the sheet of prepreg for interlayer connection, and thereby the respective pads on said plurality of laminating double-side circuit boards are electrically connected with one another, and said multilayer printed wiring board is structured so that said plurality of laminating double-side circuit boards and said plurality sheets of prepreg for interlayer connection are laminated.