Stress release feature for PWBs
AssigneeNokia Corporation
InventorMartin Borcher Christensen
Life of this patent
Estimating the term…
Abstract
SUMMARY An element, such as a Printed Wired Board (PWB) or Printed Circuit Board (PCB) is provided with elongated lower-stiffness areas, which provide the element with areas obtaining a lower deformation during deformation of the element, such as during a fall thereof. Fragile or large electronic or electrical parts, such as Integrated Circuits (IC), such as Ball Grid Arrays (BGA) are positioned the lower deformation areas in order to maintain electrical connection to the element during and after the deformation of the element.
Claims19
An element having:
- one or more electrical conductors thereon or therein,
- one or more electrical or electronic parts attached to the element and in electrical connection with one or more of the conductors,
- the element having one or more elongated bending areas with a stiffness lower than a stiffness of the element in areas adjacent to the bending areas.
An element according to any of the preceding claims, wherein one or more of the elongated areas are adjacent to one of the parts.
An assembly having an element according to any of the preceding claims and a base part, the element being attached to the base part at one or more points or areas of the element.
A mobile telephone comprising an assembly according to any of claims and 7.
A method of providing an element having:
- one or more electrical conductors thereon or therein, and
- one or more electrical or electronic parts attached to the element and in electrical connection with one or more of the conductors,
- the method comprising providing, in the element, one or more elongated bending areas with a stiffness lower than a stiffness of the element in areas adjacent to the bending areas.
Dependencies are inferred from the claim text.