Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

A heat exchanger for cooling a heat source comprising:

• a. a manifold layer including a first set of fingers in a first configuration, wherein each finger in the first set channels fluid at a first temperature, the manifold layer further including a second set of fingers in a second configuration, wherein each finger in the second set channels fluid at a second temperature, the first set and second set of fingers arranged parallel to each other;
• and
• b. an interface layer configured to receive fluid at the first temperature at a plurality of first locations, wherein each first location is associated with a corresponding finger in the first set, the interface layer passing fluid along a plurality of predetermined paths to a plurality of second locations, wherein each second location is associated with a corresponding finger in the second set.

A manifold structure configureable to be coupled to a heat exchanger, wherein the heat exchanger is configured to cool a heat source, the manifold structure comprising:

• a first set of fingers for providing fluid at a first temperature to a heat exchange region of the heat exchanger, wherein the fluid in the heat exchange region performs thermal exchange with the heat source and flows toward a second set of fingers in the manifold structure at a second temperature, each finger disposed parallel to each other along a dimension and spaced apart by an appropriate distance to reduce pressure drop in the heat exchanger.