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US 2004/0103960 A1Published application
Method for the patterned, selective metallization of a surface of a substrate
AssigneeInfineon Technologies AG
InventorGunter Schmid
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Abstract
The present invention provides a method for the patterned metallization of a surface of a substrate, comprising the steps of preheating the substrate to a temperature which is below a deposition temperature of a predetermined metal dissolved in a fluid provided above the surface, and performing patterned deposition of the predetermined metal in predetermined regions on the surface of the substrate by locally increasing the temperature to above the deposition temperature.
Claims23
A method for patterned metallization of a surface of a substrate, comprising the steps of:
- preheating the substrate to a temperature which is below a deposition temperature of a predetermined metal dissolved in a fluid provided above the surface of the substrate;
- and
- performing patterned deposition of the predetermined metal in predetermined regions on the surface of the substrate by locally increasing the temperature at the surface of the substrate to above the deposition temperature.
Dependencies are inferred from the claim text.