Single wafer cleaning with ozone
OwnerMichael Kenny, Brian Aegeter +2inventors
InventorsMichael Kenny, Brian Aegeter, Eric Bergman, Dana Scranton
Life of this patent
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Abstract
In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. Preferably, the liquid includes water, and may also include a chemical. Steam may also be used with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. Sonic or electromagnetic energy may also be introduced to the workpiece.
Claims21
A method for cleaning a single workpiece, comprising the steps of:
- forming a layer of a liquid on the workpiece, with the liquid heated to a temperature above 25C;
- and
- providing ozone into the environment around the workpiece with ozone diffusing through the layer of liquid and chemically reacting with a contaminant at the surface of the workpiece, to clean the workpiece.
An apparatus for cleaning a workpiece, comprising:
- a process chamber;
- a support in the process chamber for holding a single workpiece;
- an ozone source connecting into the process chamber;
- one or more liquid outlets in the process chamber;
- a source of liquid connecting to the liquid outlet in the process chamber;
- and
- a liquid heater associated with the source of liquid, for heating the liquid.
An apparatus for cleaning a workpiece, comprising:
- a process chamber;
- support means in the process chamber for holding a single workpiece;
- ozone supply means for supplying ozone into the process chamber;
- one or more liquid outlets in the process chamber;
- a source of liquid connecting to the liquid outlet in the process chamber;
- and
- liquid heating means for heating the liquid.
Dependencies are inferred from the claim text.