Paste for electroless plating and method of producing metallic structured body, micrometallic component, and conductor circuit using the paste
AssigneeSumitomo Electric Industries, Ltd.
InventorsJun Yorita, Masatoshi Majima, Shinji Inazawa
Life of this patent
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Abstract
A paste for electroless plating 1′ comprises (a) a minute catalytic powder 11 at least the surface of which is formed by a catalytic metal or a metal capable of substituting for the catalytic metal and (b) a vehicle 10 in which the catalytic powder 11 is dispersed. The paste is used to form a film. A method that plates the film by electroless plating produces a metallic structured body, a micrometallic component, and a conductor circuit, all having a uniform crystal structure unattainable by electroplating using a conductive paste.
Claims21
A paste for electroless plating, comprising:
- (a) a minute catalytic powder at least the surface of which is formed by one member selected from the group consisting of:
- (a1) a catalytic metal having a catalytic function as an underlying material for electroless plating (hereinafter referred to as the catalytic metal (1));
- and
- (a2) a metal capable of substituting for the catalytic metal (1) when brought into contact with a solution containing the ion of the catalytic metal (1) (hereinafter referred to as the metal (2));
- and
- (b) a vehicle in which the catalytic powder is dispersed.
A method of producing a metallic structured body, the method comprising the steps of:
- (a) preparing a paste for electroless plating that comprises:
- (a1) a minute catalytic powder at least the surface of which is formed by one member selected from the group consisting of the catalytic metal (1) and the metal (2);
- and
- (a2) a vehicle in which the catalytic powder is dispersed;
- (b) preparing a precursor of the metallic structured body, the precursor having a three-dimensional structure;
- (c) applying the paste onto the surface of the precursor to form an underlying film;
- and
- (d) growing a metallic film on the surface of the underlying film through electroless plating by exploiting the catalytic function of the catalytic powder exposed on the surface of the underlying film.
A method of producing a micrometallic component, the method comprising the steps of:
- (a) preparing a paste for electroless plating that comprises:
- (a1) a minute catalytic powder at least the surface of which is formed by one member selected from the group consisting of the catalytic metal (1) and the metal (2);
- and
- (a2) a vehicle in which the catalytic powder is dispersed;
- (b) preparing a substrate;
- (c) preparing a mold form provided with a patterned through hole corresponding with the shape of the micrometallic component to be produced;
- (d) applying the paste onto the substrate;
- (e) overlaying the mold form on the applied paste;
- (f) solidifying the paste while maintaining the overlaying condition to form an underlying film and to securely bond the mold form to the substrate at the same time so that a mold can be produced;
- and
- (g) selectively growing a metallic film corresponding with the shape of the patterned through hole on the surface of the underlying film exposed in the patterned through hole of the mold by electroless plating utilizing the catalytic function of the catalytic powder exposed on the surface of the underlying film.
A method of producing a micrometallic component, the method comprising the steps of:
- (a) preparing a paste for electroless plating that comprises:
- (a1) a minute catalytic powder at least the surface of which is formed by one member selected from the group consisting of the catalytic metal (1) and the metal (2);
- and
- (a2) a vehicle in which the catalytic powder is dispersed;
- (b) preparing a substrate;
- (c) on the substrate, forming by using the paste the pattern of an underlying film corresponding with the shape of the micrometallic component to be produced;
- and
- (d) selectively growing a metallic film corresponding with the shape of the underlying film on the surface of the underlying film on the substrate by electroless plating utilizing the catalytic function of the catalytic powder exposed on the surface of the underlying film.
A method of producing a conductor circuit, the method comprising the steps of:
- (a) preparing a paste for electroless plating that comprises:
- (a1) a minute catalytic powder at least the surface of which is formed by one member selected from the group consisting of the catalytic metal (1) and the metal (2);
- and
- (a2) a vehicle in which the catalytic powder is dispersed;
- (b) preparing a substrate;
- (c) on the substrate, forming by using the paste the pattern of an underlying film corresponding with the shape of the conductor circuit to be produced;
- and
- (d) selectively growing a metallic film corresponding with the shape of the underlying film on the surface of the underlying film on the substrate by electroless plating utilizing the catalytic function of the catalytic powder exposed on the surface of the underlying film.
Dependencies are inferred from the claim text.