Method for manufacturing circuit devices

A method of manufacturing circuit devices, comprising:

• preparing a laminated plate by laminating a thin first conductive film and a thick second conductive film via a third conductive film;
• selectively forming pads formed of a fourth conductive film on said first conductive film;
• forming a fine conductive pattern layer by etching said first conductive film into a desirable pattern;
• removing said third conductive film by use of the conductive pattern layer as a mask and thus forming anchor portions where said third conductive film is depressed further inside than said conductive pattern layer;
• fixedly fitting semiconductor elements on said conductive pattern layer via an insulating adhesive layer and filling said insulating adhesive layer into said anchor portions;
• electrically connecting electrodes of said semiconductor elements with said pads on predetermined parts of said conductive pattern layer;
• covering said semiconductor elements with a sealing resin layer and filling said sealing resin layer into the anchor portions;
• and
• exposing said sealing resin layer and third conductive film on the rear surface by removing said second conductive film.