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US 2004/0076797 A1Published application
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
AssigneeShellcase Ltd.
InventorsGil Zilber, Reuven Katraro, Doron Teomim
Life of this patent
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Abstract
A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer and at least one opening in the packaging layer communicating with the at least one gap.
Claims36
A crystalline substrate based device comprising:
- a crystalline substrate having formed thereon a microstructure, and
- at least one packaging layer which is formed over said microstructure and defines therewith:
- at least one gap between said crystalline substrate and said at least one packaging layer;
- and
- at least one opening in said packaging layer communicating with said at least one gap.
2 more elements
A packaged crystalline substrate comprising:
- a substrate having formed thereon a microstructure;
- and
- at least one package which is attached to said substrate over said microstructure and defines therewith at least one gap, said at least one package containing at least one opening communicating with said at least one gap.
Dependencies are inferred from the claim text.