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US 2004/0072506 A1Published application
Fixed abrasive article for use in modifying a semiconductor wafer
Assignee3M Innovative Properties Company
InventorDouglas P. Goetz
Life of this patent
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Abstract
An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.
Claims17
An apparatus for modifying the surface of a semiconductor wafer, said apparatus comprising
- a) a fixed abrasive element comprising a plurality of abrasive particles;
- b) a resilient element;
- and
- c) a plurality of rigid segments disposed between said fixed abrasive element and said resilient element.
1 more element
Dependencies are inferred from the claim text.