Polishing member and method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsYukiteru Matsui, Hiroyuki Yano
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Abstract
There is provide a polishing member including photocatalyst particles that exhibit photocatalysis on light irradiation, and a support material that supports the photocatalyst particles. There is also provided a method of manufacturing a semiconductor device, including polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with the polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performing light irradiation onto the polishing member.
Claims20
A polishing member comprising:
- photocatalyst particles that exhibit photocatalysis on light irradiation;
- and
- a support material that supports the photocatalyst particles.
A method of manufacturing a semiconductor device, comprising:
- polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with a polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performing light irradiation onto the polishing member, the polishing member comprising photocatalyst particles that exhibit photocatalysis on the light irradiation and a support material that supports the photocatalyst particles.
Dependencies are inferred from the claim text.