Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device

A resist pattern comprising:

• a resist pattern thickening material to cover a surface of a resist pattern to be thickened so as to thicken the resist pattern to be thickened,
• wherein the resist pattern thickening material is applied onto the resist pattern to be thickened after forming the resist pattern to be thickened, and the resist pattern thickening material comprises:
• a resin;
• and
• a surfactant.

A process for forming a resist pattern, comprising the steps of:

• forming a resist pattern to be thickened;
• coating a resist pattern thickening material so as to cover a surface of the resist pattern to be thickened;
• and
• forming a resist pattern in which the resist pattern to be thickened is thickened
• wherein the resist pattern thickening material comprises a resin;
• and a surfactant.

A process for manufacturing a semiconductor device comprising the steps of:

• forming a resist pattern wherein, after forming a resist pattern to be thickened on an underlying layer, the resist pattern to be thickened is coated by a resist pattern thickening material so as to cover a surface of the resist pattern to be thickened, so as to form a resist pattern in which the resist pattern to be thickened is thickened;
• and
• patterning the underlying layer by etching by using the resist pattern
• wherein the resist pattern thickening material comprises a resin;
• and a surfactant.