Radiation sensitive resin composition

A radiation-sensitive resin composition comprising:

• (A) a resin comprising a hydroxyl group or carboxyl group, of which the hydrogen atom has been replaced by an acid-dissociable group possessing an alkali dissolution controlling capability, wherein the acid-dissociable group dissociates by the action of an acid generated by irradiation and increases the solubility of the resin in an alkaline aqueous solution and
• (B) a photoacid generator, which comprises a compound (B-1) shown by the following formula (1),
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• wherein the groups R1 individually represent a hydrogen atom or a linear or branched alkyl group having 1-4 carbon atoms, n is 0 or 1, R2 and R3 individually represents a hydrogen atom, a linear or branched alkyl group having 1-4 carbon atoms, or R2 and R3 bond together with the sulfur atom in the formula to form a 3-6 member cyclic structure, and X− represents a substituted or unsubstituted, linear or branched fluoroalkylsulfonic acid anion having 1-15 carbon atoms or a disulfonylimide acid anion represented by the following formula (i),
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• wherein two R4 groups individually represent a linear or branched fluoroalkyl group having 1-15 carbon atoms, and a compound (B-2) shown by the following formula (2),
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• wherein the groups R5 individually represent a hydrogen atom, a hydroxyl group or a derivative thereof, or a linear or branched alkyl group having 1-4 carbon atoms and Y− represents a substituted or unsubstituted, linear or branched fluoroalkyl sulfonic acid anion having 2-15 carbon atoms.