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US 2004/0071035 A1Published application
Memory module with a heat dissipation means
AssigneeInfineon Technologies AG
InventorPeter Poechmueller
Life of this patent
Estimating the term…
Abstract
A memory module includes a board, a memory device attached to the board, and a heat dissipation means arranged between the memory device and the board.
Claims12
A memory module comprising:
- a board;
- a memory device attached to the board;
- and
- a heat dissipation means arranged between the memory device and the board.
1 more element
Dependencies are inferred from the claim text.