Multi-layer board, its production method, and mobile device using multi-layer board

A multi-layer board comprising:

• a plurality of conductive patterns piled with having resin films, made of thermoplastic resin, therebetween;
• and
• two separation boards of a first and a second separation boards,
• wherein, before being heated and pressurized, the first and the second separation boards are located at an upper side and a lower side, respectively, of at least one release film that is sandwiched in a region between two of the resin films,
• wherein, after being heated and pressurized, the first and the second separation boards and the release film are separated for the release film to be removed,
• wherein one of the two separation boards is folded at an angle relative to a position prior to being separated, and
• wherein a component can be mounted on at least one released surface of the two separation boards;

A mobile device comprising:

• a multi-layer board, wherein the multi-layer board includes,
• a plurality of conductive patterns piled with having resin films, made of thermoplastic resin, therebetween, and
• two separation boards of a first and a second separation boards,
• wherein, before being heated and pressurized, the first and the second separation boards are located at an upper side and a lower side, respectively, of at least one release film that is sandwiched in a region between the resin films,
• wherein, after being heated and pressurized, the first and the second separation boards and the release film are separated for the release film to be removed, and
• wherein one of the two separation boards is folded at an angle relative to a position prior to being separated;
• and
• a component mounted on at least one released surface of the two separation boards of the multi-layer board.

A multi-layer board produced by a method that comprises:

• a pattern forming step of forming a conductive pattern on at least one surface of a resin film made of thermoplastic resin;
• a piling step of piling up, with sandwiching at least one release film in a given region, a plurality of resin films that include the resin film that is provided with the conductive pattern;
• a heating and pressurizing step of heating and pressurizing with a press mold a pile of the resin films including the release film so that the resin films mutually adhere to form the multi-layer board;
• a first mounting step of mounting a component on a surface of the multi-layer board;
• a separating step of separating the release film, a first separation board, and a second separation board to remove the release film, wherein the first separation board is a first portion of the multi-layer board that is located on the release film while the second separation board is a second portion of the multi-layer board that is located under the release film;
• and
• a second mounting step of mounting a component on at least one released surface of the first and second separation boards in a state where at least one separation board of the first and second separation boards is folded at an angle relative to a position prior to being separated.

A mobile device comprising:

• a multi-layer board;
• and
• a component mounted on at least one of two released surfaces of two separation boards of the multi-layer board,
• wherein the multi-layer board produced by a method that includes:
• a pattern forming step of forming a conductive pattern on at least one surface of a resin film made of thermoplastic resin;
• a piling step of piling up, with sandwiching at least one release film in a given region, a plurality of resin films that include the resin film that is provided with the conductive pattern;
• a heating and pressurizing step of heating and pressurizing with a press mold a pile of the resin films including the release film so that the resin films mutually adhere to form the multi-layer board;
• a first mounting step of mounting a component on a surface of the multi-layer board;
• a separating step of separating the release film, a first separation board of the two separation boards, and a second separation board of the two separation boards to remove the release film, wherein the first separation board is a first portion of the multi-layer board that is located on the release film while the second separation board is a second portion of the multi-layer board that is located under the release film;
• and
• a folding step of folding at least one separation board of the two separation boards, at an angle relative to a position prior to being separated, to form the released surfaces of the two separation boards.