Circuit card module including mezzanine card heat sink and related methods
AssigneeHarris Corporation
InventorsRobert Grayson Wells, Todd David Beak
Life of this patent
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AssigneeHarris Corporation
InventorsRobert Grayson Wells, Todd David Beak
Estimating the term…
A circuit card module to be received in a card chassis includes a host card assembly and a mezzanine card assembly carried in spaced relation by the host card assembly. The host card assembly includes a host card heat sink having an end to connect to the card chassis to conduct heat thereto, and a host circuit card mounted on the host card heat sink. The mezzanine card assembly includes a mezzanine card heat sink, and a mezzanine circuit card mounted on the mezzanine card heat sink. The mezzanine card heat sink has an end to connect to the card chassis to conduct heat thereto in parallel with heat conducted from the host card heat sink to the card chassis. The mezzanine card heat sink may comprise a body adjacent the mezzanine circuit card, and a flexible strap extending outwardly therefrom to connect to the card chassis.
A circuit card module to be received in a card chassis, the circuit card module comprising:
A circuit card module to be received in a card chassis, the circuit card module comprising:
A circuit card module to be received in a card chassis, the circuit card module comprising:
A mezzanine card assembly to be carried by a host card assembly in spaced relation therefrom and to conduct heat to a card chassis receiving the host card assembly, the mezzanine card assembly comprising:
A method for conduction cooling of a mezzanine circuit card assembly comprising:
Dependencies are inferred from the claim text.