Composite fins for heat sinks
AssigneeIntel Corporation
InventorsGregory M. Chrysler, Agostino C. Rinella
Life of this patent
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Abstract
A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.
Claims26
A heat sink for dissipating thermal energy from an electronic device, the heat sink comprising:
- a base adapted to be thermally coupled to the electronic device;
- and
- a fin thermally coupled to the base, the fin including a first portion made from a first material and a second portion made from a second material, wherein one edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion.
A heat sink for dissipating thermal energy from an electronic device, the heat sink comprising:
- a copper base adapted to be thermally coupled to the electronic device;
- and a fin thermally coupled to the base, the fin comprising a copper portion and an aluminum portion such that the copper portion of the fin conducts thermal energy away from the copper base to the aluminum portion of the fin, wherein one edge of the copper portion and an opposing edge of the aluminum portion form at least one of a lap joint and a butt joint between the copper portion and the aluminum portion.
A method comprising:
- constructing a fin by joining one edge of a first portion made from a first material to an opposing edge of a second portion made from a second material to form at least one of a butt joint and a lap joint between the first portion and the second portion;
- thermally coupling the fin to a base to form a heat sink;
- and
- thermally coupling the heat sink to an integrated circuit such that the heat sink conducts thermal energy away from the integrated circuit during operation of the integrated circuit.
A computer system comprising:
- an integrated circuit board;
- a processor coupled to the integrated circuit board;
- and
- a heat sink thermally coupled to the processor, the heat sink comprising a base to transfer heat away from the processor, and a fin thermally coupled to the base, the fin including a first portion made from a first material and a second portion made from a second material, wherein one edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion.
Dependencies are inferred from the claim text.