Method for making a block for testing components
AssigneeCommissariat a l'Energie Atomique
InventorsFrancois Baleras, Catherine Brunet-Manquat
Life of this patent
Estimating the term…
Abstract
The invention relates to a test socket (10) for an electronic component, comprising a embossed support layer (12) comprising several embossments (16) with projecting relief, the embossments being provided with at least one conducting test area (14) near the top of the embossment, that may be brought into electrical contact with a terminal of the component. Application to testing bare or packaged electronic components.
Claims7
Method for the manufacture of a test socket with an embossed support layer (12) comprising several embossments (16) with projecting relief, the embossments being provided with at least one conducting test area (14) near the top of the embossment, that may be brought into electrical contact with a terminal of the component, the method comprising the following steps:
- a) the formation of cavities (42) in a substrate (42) forming relief with a shape corresponding to or complementary to an embossment of a support layer,
- b) shaping the support layer on the substrate, so as to form embossments (16) in the layer corresponding to the cavities, and separation of the support layer (12) from the substrate, c) the formation of test areas (14) by forming a metal layer.
Dependencies are inferred from the claim text.