Multilayer ceramic electronic component manufacturing method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAtsuo Nagai, Jun Otsuki, Hideki Kuramitsu, Keiji Kobayashi
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Abstract
A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.
Claims9
A method of manufacturing a multilayer ceramic electronic component, the method comprising the steps of:
- (A) alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body;
- and
- (B) sintering the laminated body,
- wherein the adhesive layer includes a thermoplastic resin and at least one of inorganic powders including:
- (1) Cr, Mg, Al, Si;
- (2) a Cr compound, an Mg compound, an Al compound, an Si compound;
- and
- (3) a kind of inorganic powder included in the ceramic sheet.
Dependencies are inferred from the claim text.