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US 2004/0070649 A1Published application
Fluid-ejection devices and a deposition method for layers thereof
AssigneeHewlett-Packard Development Company, L.P.
InventorsUlrich E. Hess, Samson Berhane, Arjang Fartash
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Abstract
Atomic layer deposition forms a cavitation layer of a print head.
Claims34
A print head comprising:
- a cavitation layer formed by an atomic layer deposition process.
A fluid-ejection device comprising:
- a die having a plurality of layers formed thereover;
- a firing chamber formed from the plurality of layers, from which heated fluid is ejected, wherein a first layer of the plurality of layers is a cavitation layer of the firing chamber that is formed by atomic layer deposition.
A print head comprising:
- a die;
- a firing chamber disposed upon the die, the firing chamber comprising an ALD cavitation layer;
- a heating element interposed between the die and the firing chamber;
- and
- an ALD passivation layer interposed between the heating element and the firing chamber.
2 more elements
A fluid-ejection device comprising:
- a die;
- a firing chamber disposed upon the die, the firing chamber comprising a cavitation layer formed by atomic layer deposition;
- a heating element interposed between the die and the firing chamber;
- and
- a dielectric film, interposed between the heating element and the cavitation layer, wherein the dielectric film is formed by atomic layer deposition.
2 more elements
A method of forming a cavitation layer of a print head, the method comprising:
- utilizing an atomic layer deposition process.
A method of fabricating a fluid-ejection device comprising:
- utilizing an atomic layer deposition process to deposit a seed layer;
- and
- forming a second layer on the seed layer.
A method of fabricating a fluid-ejection device comprising:
- forming a firing chamber, for ejecting fluid therefrom, on a substrate, wherein forming the firing chamber comprises forming a cavitation layer using atomic layer deposition.
A method of manufacturing a print head comprising:
- forming a plurality of layers over a substrate;
- forming a dielectric film over the plurality of layers using atomic layer deposition;
- and
- forming a firing chamber, for ejecting fluid therefrom, over the dielectric film, wherein forming the firing chamber comprises forming a cavitation layer using atomic layer deposition.
1 more element
Dependencies are inferred from the claim text.