Platinum temperature sensor
AssigneeSensotherm Temperatursensorik GmbH
InventorHeinrich Zitzmann
Life of this patent
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Abstract
A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cover layer is connected with the ceramic substrate in such a way via the connecting layer that the platinum thin-film resistor is sealingly encapsulated with regard to the environment.
Claims17
Platinum temperature sensor comprising:
- a ceramic substrate;
- a platinum thin-film resistor applied to the ceramic substrate;
- a ceramic cover layer;
- and
- a connecting layer produced from a ceramic green sheet by pressure and temperature treatment, by means of which the ceramic cover layer is connected with the ceramic substrate in such a way that the platinum thin-film resistor is sealingly encapsulated with re-gard to the environment.
Platinum temperature sensor comprising:
- a ceramic substrate;
- a platinum thin-film resistor applied to the ceramic substrate;
- a ceramic cover layer;
- and
- a connecting layer made of a glaze that is applied to the ceramic substrate in a boarder area surrounding the platinum thin-film resistor by means of which the ceramic cover layer is connected with the ceramic substrate in such way that the platinum thin-film resistor is sealingly encapsulated with regard to the environment.
6 Platinum temperature sensor according to claim 1 wherein the ceramic substrate is made of Al203.
Method for producing a platinum temperature sensor comprising the steps of:
- a) providing a fired ceramic substrate with a platinum thin-film resistor applied to the main surface thereof;
- b) applying a connecting layer made of a ceramic green layer to the main surface of the ceramic substrate;
- and
- c) applying a fired ceramic cover layer to the connecting layer in such a way that the platinum thin-film resistor is sealingly encapsulated with regard to the environment by subjecting the ceramic green layer to a temperature treatment under application of pressure in such a way that the ceramic substrate and the ceramic cover layer will be connected.
Dependencies are inferred from the claim text.