Oscillator package

An oscillator comprising:

• a) a substrate having a top surface and a bottom surface and four walls extending outwardly from the bottom surface, the four walls defining a bottom cavity therein;
• b) a seal ring attached to the top surface, the seal ring defining a top cavity;
• c) a plurality of first contact pads located on the top surface;
• d) a plurality of second contact pads located on the bottom surface;
• e) a plurality of circuit lines located in the substrate;
• f) a plurality of vias located in the substrate, the vias extending through the substrate and electrically connected to the first and second contact pads and the circuit lines;
• g) a semiconductor die located in the bottom cavity and electrically connected with the second contact pads;
• h) a sealant covering the semiconductor die;
• i) a crystal located in the top cavity, the crystal having an electrode pad;
• j) a thermosonically deposited metal bump attached between the electrode pad and the first contact pad, the metal bump providing an electrical connection between the crystal and the substrate, the metal bump mechanically supporting the crystal;
• and
• k) a cover attached to the seal ring for hermetically sealing the top cavity.

A method of manufacturing an oscillator package comprising:

• a) providing a substrate having a top surface, a bottom surface and four walls extending outwardly from the bottom surface, the four walls defining a bottom cavity therein, the top surface having a plurality of first contact pads, the bottom surface having a plurality of second contact pads, vias extending through the substrate and connected to the first and second contact pads, a seal ring attached to the top surface, the seal ring defining a top cavity;
• b) depositing a metal bump on the first contact pad;
• c) placing a crystal electrode attached to a first surface of a crystal over the metal bump;
• d) contacting a thermosonic transducer to a second surface of the crystal;
• e) applying thermosonic energy to the crystal such that the metal bump attaches to the crystal electrode;
• f) removing the thermosonic transducer;
• g) tuning the crystal to a resonant frequency;
• and
• h) welding a cover onto the seal ring such that the crystal is hermetically sealed.

An oscillator package comprising:

• a) a substrate having a center wall, the center wall located between a top cavity and a bottom cavity, the center wall having a first surface adjacent the top cavity and a second surface adjacent the bottom cavity, the substrate having a length and width less than 5.0 millimeters;
• b) a plurality of first contact pads located on the first surface;
• c) a plurality of second contact pads located on the second surface;
• d) a semiconductor die mounted to the second surface and electrically connected with the second contact pads;
• e) a crystal mounted to the first surface, the crystal having a first end and a second end;
• f) an electrode pad located at the first end of the crystal;
• g) at least one thermosonically deposited metal bump attached between the electrode pad and the first contact pad, the metal bump providing an electrical connection between the crystal and the first contact pad, the metal bump mechanically supporting the crystal;
• and
• h) a plurality of vias extending through the substrate for forming electrical connections between the first and second contact pads.

An oscillator package having a length less than 7.0 millimeters and a width less than 5.0 millimeters, the package having an overall package area less than 35.0 square millimeters comprising:

• a) a crystal receptacle having a first base and first side walls, the first side walls defining the crystal receptacle, the crystal receptacle having a receptacle area, the receptacle area taking up the majority of the overall package area;
• b) an integrated circuit receptacle having a second base and second side walls, the second side walls defining the integrated circuit receptacle;
• c) a planar crystal blank having a crystal area, the crystal blank mounted in the crystal receptacle, the crystal area taking up the majority of the receptacle area;
• d) a first metal bump located between the base and the crystal, the metal bump affixing the crystal to the base;
• e) an integrated circuit mounted in the integrated circuit receptacle;
• and
• f) a second metal bump located between the second base and the integrated circuit, the second metal bump affixing the integrated circuit to the base.